GE IC200CHS022

Product Overview The IC200CHS022 is a compact box-style I/O carrier designed for space-constrained installations within the VersaMax series. It provides mounting, backplane communications, and field wiring termination for one I/O module in a vertically-oriented, space-efficient package.

Category: SKU: GE IC200CHS022

Description

GE IC200CHS022 Technical Specifications

  • Carrier Style: Compact box-style

  • Terminals: 36 IEC box-style terminals (A1–A18, B1–B18)

  • Dimensions: 66.8 mm (W) × 70 mm (D) × 167.89 mm (H) — 2.63 in × 2.75 in × 6.61 in

  • Weight: 0.75–0.91 kg (varies by source)

  • Voltage Rating: 0–264 VAC

  • Maximum Voltage per Point: 264 VAC

  • Transient Voltage: Up to 300 VAC

  • Current Rating: 2 A per point; 8 A per power/ground terminal

  • Wire Compatibility: Single wire: AWG #14 to #22 (0.36–2.1 mm²); Two-wire: AWG #18 (0.86 mm²)

  • Terminal Torque: 0.37–0.5 lbf·ft

  • Mounting: 35 mm DIN rail (7.5 mm × 35 mm) or panel mounting

  • Mounting Clearance: Top/bottom: 2 in (5.1 cm); Side: 1 in (2.54 cm)

  • Operating Temperature: 0°C to +60°C (32°F to 140°F)

  • Supply Voltage: 5 V DC (backplane)

Structural Features

  • I/O module mounts vertically (perpendicular to DIN rail)
  • Built-in card holder that hinges down over terminal wiring
  • Wiring card provided with I/O module inserts into holder
  • Card holder retracts during system operation
  • Easy-keying dials to match module keying and prevent misinstallation
  • Carrier-to-carrier mating connectors for quick backplane connection
  • Module latch hole for secure fastening

Hazardous Location Ratings Certified for Class I, Division 2, Groups A, B, C, D, and Class 1 Zone 2 locations.

Installation Requirements Snaps onto 7.5 mm × 35 mm DIN rail. The rail must be electrically grounded with a conductive, unpainted, corrosion-resistant finish for EMC protection. For applications requiring maximum vibration and shock resistance, panel-mount the carrier in addition to DIN rail mounting. One inch of horizontal spacing and two inches of vertical spacing should be provided around the mounted module.

Applications

  • Compact control panels with limited depth
  • Embedded control systems
  • Space-constrained machine control installations
  • Distributed I/O nodes in crowded electrical enclosures