Description
Motorola MVME2700-1431
Technical Specifications
- Microprocessor: Powered by a 32-bit PowerPC 750 microprocessor.
- Cache Architecture: Features 32KB of L1 cache and 1MB of backside L2 cache memory.
- Memory Expansion: Supports 16MB to 256MB of ECC DRAM via the RAM200 mezzanine module.
- Storage: Equipped with 8MB of onboard Flash memory and a 1MB slot-in Flash option.
- Power Requirements: Operates on standard VME power rails, requiring +5Vdc, +12Vdc, and -12Vdc.
Functional Features
- Sensor Integration: Optimized for connecting and managing industrial sensors and automated control modules.
- Advanced Connectivity: Features an Ethernet transceiver interface with DMA, 8-bit or 16-bit Fast SCSI-2 bus, and multiple synchronous/asynchronous serial ports.
- Expansion Flexibility: Includes a 64-bit PCI mezzanine connector compliant with IEEE P1386.1 for PMC expansion.
- System Diagnostics: Incorporates an onboard debug monitor with self-test diagnostics, NVRAM with a replaceable battery backup clock, and four 32-bit timers.
Application Scenarios
- Industrial Automation: Centralized control in distributed control systems (DCS) and programmable logic controllers.
- Process Monitoring: Real-time data acquisition from factory floor sensors and machinery.
- Automated Testing: Core processing unit in automated test equipment (ATE).
Performance Parameters
- Operating Temperature: 0°C to 55°C with forced-air cooling.
- Storage Temperature: -40°C to +85°C.
- Humidity: 5% to 90% relative humidity (non-condensing).
- Bus Performance: High-speed DMA for fast local memory to VMEbus transfers.
Material Composition
Constructed using industrial-grade electronic components, precision multi-layer printed circuit boards (PCBs), and specialized ASICs for bus management and I/O control.
Structural Characteristics
- Form Factor: Double-high 6U VME board.
- Dimensions: Base board height is 9.2 inches (233 mm) and depth is 6.3 inches (160 mm). With the front panel and connectors, the depth extends to 10.3 inches (262 mm).
- Modular Design: User-configurable jumpers are accessible with the RAM200 mezzanine installed.
Working Principle
The PowerPC 750 processor executes real-time operating system instructions, managing data flow between the ECC DRAM, VMEbus peripherals, and external I/O via dedicated DMA channels and PCI bridge controllers.
Installation Requirements
- Hardware Preparation: Ensure serial ports and all header jumpers are configured as desired before installation.
- Mezzanine Setup: Verify that the RAM200 ECC DRAM module and optional PCI mezzanine cards are properly seated.
- Cooling: Requires adequate forced-air cooling directed across the board to maintain safe operating temperatures.
Usage Precautions
- Electrostatic Discharge (ESD): Strict ESD precautions must be taken during handling to prevent damage to sensitive CMOS components.
- Jumper Configuration: Carefully verify all hardware jumpers and switch settings prior to applying power to prevent configuration conflicts.
