Description
Motorola MVME2700-3321
Technical Specifications
- Microprocessor: Powered by a 32-bit PowerPC 750 (MPC750) RISC processor, operating at high clock speeds (typically 233 MHz, 266 MHz, or 366 MHz).
- Cache Memory: Features 32KB of L1 instruction/data cache and 1MB of backside L2 cache memory for optimized processing performance.
- Memory Architecture: Supports 16MB to 256MB of Error-Correcting Code (ECC) DRAM via the RAM200 memory expansion module, with 1MB of base board DRAM.
- Storage: Includes 1MB of 16-bit Flash memory on the base board (via two 32-pin PLCC sockets) and supports 4MB or 8MB of 64-bit Flash memory on the RAM200 module.
- Power Requirements: Operates on standard VME power rails: +5Vdc (±5%) at 5.5A typical / 6.5A maximum; +12Vdc (±10%) at 250mA typical / 500mA maximum; and -12Vdc (±10%) at 100mA typical / 250mA maximum.
Functional Features
- Advanced VMEbus Interface: Functions as a VMEbus system controller, supporting A24/A32 addressing and D8/D16/D32/D64 block transfers with high-speed Direct Memory Access (DMA).
- High-Speed Connectivity: Integrates a DECchip 21140 Ethernet controller with 32-bit PCI local bus DMA, and an 8-bit or 16-bit Fast SCSI-2 bus interface via the SYM53C825A controller.
- Comprehensive I/O: Features multiple synchronous/asynchronous serial ports, an IEEE 1284 bidirectional parallel port, and interfaces for keyboard, mouse, and floppy disk drives via the PC87308 Super I/O controller.
- Expansion Capabilities: Includes an IEEE P1386.1 compliant 32/64-bit PCI Mezzanine Card (PMC) slot and a 114-pin Mictor connector for additional PMC carrier boards (PMCspan).
- System Management: Equipped with an 8KB x 8 NVRAM with a Real-Time Clock (RTC) and replaceable battery backup, four 32-bit programmable timers, and a hardware watchdog timer.
Application Scenarios
- Industrial Automation: Serves as a central processing node in Distributed Control Systems (DCS), Programmable Logic Controllers (PLC), and CNC machinery.
- Telecommunications: Deployed in network routing, switching infrastructure, and high-speed data acquisition systems.
- Defense & Aerospace: Utilized in ruggedized military computing, radar signal processing, and flight simulation equipment.
- Medical Systems: Applied in advanced diagnostic imaging and patient monitoring systems requiring high reliability.
Performance Parameters
- Operating Temperature: 0°C to 55°C entry air temperature with forced-air cooling.
- Storage Temperature: -40°C to +85°C for non-operating conditions.
- Humidity: 5% to 90% relative humidity (non-condensing).
- Bus Performance: Supports high-speed DMA for fast local memory to VMEbus transfers, including D16/BLT, D32/BLT, and D64/MBLT block transfers.
Material Composition
Constructed using high-quality, UL-recognized printed wiring boards (PWBs) with a 94V-0 flammability rating. It incorporates industrial-grade silicon components, precision Application-Specific Integrated Circuits (ASICs) like the Raven PCI-MPU bridge, and a sealed battery-backed NVRAM module.
Structural Characteristics
- Form Factor: Double-high 6U VME board.
- Dimensions: Base board height is 9.2 inches (233 mm) and depth is 6.3 inches (160 mm). With the front panel and connectors, the depth extends to 10.3 inches (262 mm) and height to 7.4 inches (188 mm).
- Front Panel Width: 0.8 inches (20 mm).
- Modular Design: Utilizes a modular memory design via the RAM200 mezzanine, allowing field upgrades without consuming additional VME slots.
