Description
Motorola MVME2700-3331
Technical Specifications
- Microprocessor: 32-bit PowerPC 750 RISC processor.
- Cache Architecture: Features 32KB of L1 cache and 1MB of backside L2 cache.
- Memory Configuration: Equipped with 32MB of ECC DRAM, expandable up to 256MB via the RAM200 memory mezzanine.
- Storage Capacity: Includes 8MB of onboard flash memory and 1MB of socketed flash.
- Power Requirements: Draws +5Vdc, +12Vdc, and -12Vdc directly from the VME backplane.
Functional Features
- High-Speed Bus Interface: Functions as a VMEbus system controller, supporting A24/A32 addressing and D8/D16/D32/D64 block transfers.
- Rich I/O Expansion: Provides an Ethernet transceiver interface, an 8-bit or 16-bit Fast SCSI-2 bus interface, and multiple synchronous/asynchronous serial ports.
- Flexible Expansion Slot: Features a 32/64-bit PMC expansion slot compliant with the IEEE P1386.1 standard.
- System Management: Integrates 8KB x 8 NVRAM with a replaceable battery-backed real-time clock, four 32-bit timers, and a hardware watchdog timer.
Application Scenarios
- Industrial Automation: Serves as the core processing node for Distributed Control Systems (DCS) and Programmable Logic Controllers (PLC).
- Defense and Aerospace: Utilized in radar signal processing, flight simulation, and ruggedized military computing platforms.
- Medical Equipment: Deployed in advanced diagnostic imaging and real-time patient vital signs monitoring systems.
Performance Parameters
- Operating Temperature: 0°C to 55°C with forced-air cooling.
- Storage Temperature: -40°C to +85°C.
- Relative Humidity: 5% to 90% (non-condensing).
- Bus Performance: Supports high-speed DMA for rapid data block transfers between local memory and the VMEbus.
Material Composition
Constructed using industrial-grade multi-layer printed circuit boards (PCB), high-performance ASICs (such as the Raven PCI-MPU bridge and Falcon memory controller), and a sealed battery-backed NVRAM module.
Structural Characteristics
- Physical Dimensions: Double-high 6U VME board with a base height of 9.2 inches and a depth of 6.3 inches.
- Front Panel Width: 0.8 inches.
- Modular Design: Utilizes a RAM200 memory mezzanine design, allowing field-upgradeable memory without consuming additional VME slots.
Working Principle
The PowerPC 750 processor manages system resources through Raven and Falcon ASICs while executing real-time operating system instructions. It utilizes a 64-bit PCI local bus and the VMEbus for high-speed DMA data transfers, handling network, SCSI, and serial communications, while maintaining system state and fault recovery via NVRAM and watchdog timers.
