Motorola MVME2700-3461

Product Introduction
The Motorola MVME2700-3461 is the flagship model of the MVME2700 series, factory-equipped with 256MB of ECC DRAM. With its massive memory capacity and powerful PowerPC 750 processing, it is built for demanding industrial environments running complex Real-Time Operating Systems (RTOS) and large-scale applications.

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Description

Motorola MVME2700-3461

Technical Specifications

  • Processor: PowerPC 750 32-bit RISC processor.
  • Memory: 256MB ECC DRAM (featuring double-bit error detection and single-bit error correction).
  • Cache: 32KB L1 and 1MB L2 cache.
  • Storage: 8MB onboard flash and 1MB socketed flash.
  • I/O Interfaces: Ethernet, SCSI-2, parallel port, keyboard/mouse, and floppy drive interface.

Functional Features

  • Large-Capacity Memory Buffering: 256MB of RAM supports large database caching and smooth operation of complex graphical user interfaces.
  • Comprehensive System Monitoring: Includes a watchdog timer, real-time clock (RTC), and Global Control/Status Register (GCSR) for multiprocessor communication.
  • Flexible Transition Module Support: Compatible with MVME712M or MVME761 transition modules to provide rich front-panel I/O interfaces.
  • High-Reliability Memory: ECC memory architecture effectively prevents bit flips caused by cosmic rays or electrical noise.

Application Scenarios

  • Medical Imaging: Controls image reconstruction and real-time display in CT or MRI equipment.
  • Semiconductor Manufacturing: Manages high-precision motion control and process recipe management in lithography or etching tools.
  • Traffic Control: Handles radar data processing in air traffic control systems and railway signaling.

Performance Parameters

  • Processor Frequency: Supports operating frequencies of 233 MHz, 266 MHz, or 366 MHz.
  • Memory Bandwidth: Achieves enhanced data throughput through dual-interleaved access via the Falcon memory controller.
  • Power Consumption: +5V typical current is 5.5A, with a maximum of 6.5A.

Material Composition
Utilizes high-quality FR-4 multi-layer PCBs, surface-mounted industrial-grade wide-temperature components, and includes heat sinks to assist in core chip cooling.

Structural Characteristics

  • Dimensional Specifications: Height of 9.2 inches, depth of 10.3 inches with panel, and thickness of 0.8 inches.
  • Expansion Capability: Occupies only a single VME slot even when a PMC module is installed.
  • Interface Panel: Provides standard industrial connectors such as DB-9, HD-26, or RJ-45 depending on the paired transition module.