Emerson MVME7100-0171

Emerson MVME7100-0171

Product Introduction:
The MVME7100-0171 is a high-performance VMEbus single-board computer from the MVME7100 series, built around the NXP MPC864xD system-on-chip (SoC) processor with dual PowerPC e600 cores running at up to 1.3 GHz. It delivers a balanced architecture across processor, memory, local bus, and I/O subsystems, providing a performance upgrade path for VMEbus customers migrating from legacy MPC74xx-based platforms while preserving existing chassis, backplane, and PMC infrastructure investments.

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Description

Emerson MVME7100-0171

Technical Specifications:

  • Brand: Emerson / SMART Embedded Computing
  • Product Type: VMEbus Single-Board Computer (SBC)
  • Processor: NXP MPC864xD SoC with dual PowerPC e600 cores
  • Clock Frequency: Up to 1.3 GHz
  • Memory: Up to 2 GB DDR2 ECC SDRAM
  • Flash Storage: 128 MB NOR flash; 2 GB, 4 GB, or 8 GB NAND flash options
  • VME Bus Protocol: 2eSST (Source-Synchronous Transfer) with up to 320 MB/s bandwidth
  • VME Backward Compatibility: VME64 and VME32
  • Network Interfaces: 4× Gigabit Ethernet ports
  • PMC Expansion: Dual 33/66/100 MHz PMC-X sites
  • PCI Express: 8× PCI Express expansion connector
  • USB: USB 2.0 controller (commercial temperature variant)
  • Serial Interfaces: 5× RS-232 ports
  • Operating Temperature (Extended): -40°C to +71°C
  • VME Bus Bridge: Tundra Tsi148 with Texas Instruments VME transceivers

Functional Features:

  • Dual-Core Processing: Two PowerPC e600 cores deliver parallel processing capability for demanding real-time and data-intensive applications
  • VME 2eSST High-Speed Bus: Achieves 320 MB/s VMEbus bandwidth, an 8× improvement over standard VME64, while maintaining full backward compatibility
  • Quad Gigabit Ethernet: Four independent Gigabit Ethernet interfaces support complex network topologies, redundancy, and high-throughput data acquisition
  • Dual PMC-X Expansion: Two industry-standard PMC-X mezzanine sites at up to 100 MHz enable flexible I/O customization
  • DDR2 ECC Memory: Up to 2 GB of error-correcting code memory ensures data integrity in mission-critical environments
  • USB 2.0 Integration: Facilitates connection of cost-effective peripherals such as storage devices and diagnostic tools
  • PCI Express Connectivity: 8-lane PCI Express connector supports next-generation expansion modules including XMC and SMART EC extensions

Application Scenarios:

  • Defense and aerospace command, control, and reconnaissance systems
  • Industrial automation and process control platforms
  • Medical imaging systems including CT, MRI, and PET scanners
  • Semiconductor process equipment
  • Automated test equipment (ATE)
  • Intelligent I/O blades and application-specific compute platforms
  • Multi-processor configurations with PrPMC processor modules

Performance Parameters:

  • Processor Speed: Up to 1.3 GHz dual-core
  • VME Bus Bandwidth: Up to 320 MB/s via 2eSST
  • Memory Capacity: Up to 2 GB DDR2 ECC
  • Network Throughput: 4× Gigabit Ethernet
  • PMC Bus Speed: 33 / 66 / 100 MHz
  • PCI Express Lanes: 8× expansion

Material Composition:

  • Multi-layer high-speed printed circuit board
  • NXP MPC864xD SoC in BGA package
  • Tundra Tsi148 VMEbus bridge IC
  • Texas Instruments VME transceivers
  • DDR2 ECC SDRAM modules
  • NOR and NAND flash memory ICs
  • Gigabit Ethernet PHY transceivers
  • PCI Express switch and bridge ICs

Structural Features:

  • Standard 6U VME form factor
  • Front panel with 4× Gigabit Ethernet RJ-45 connectors and USB port
  • Dual PMC-X mezzanine card sites accessible from the top surface
  • VME P1/P2 backplane connectors
  • P2 I/O connector supporting PMC and IPMC modes
  • Ejector handle mechanism for card insertion and extraction
  • Optional RTM (Rear Transition Module) connection via MVME7216E for rear-panel I/O routing

Working Principle:
The dual PowerPC e600 cores execute application code with access to integrated L2 cache and dual DDR2 memory controllers for high-bandwidth data access. The Tsi148 VMEbus bridge connects the processor’s PCI Express domain to the VME backplane, supporting both legacy VME protocols and the high-speed 2eSST protocol. The 8-lane PCI Express switch distributes connectivity to the dual PMC-X sites, the VMEbus interface, and the USB controller through dedicated PCI Express-to-PCI-X bridges, preventing I/O bottlenecks. Four Gigabit Ethernet MACs integrated within the SoC handle network communication for distributed processing architectures.

Installation Requirements:

  • Install in a standard 6U VME chassis with 2eSST-capable backplane for full bandwidth utilization
  • Ensure adequate forced-air cooling across the board surface
  • Configure P2 I/O mode jumpers (PMC or IPMC) before installation
  • Connect Gigabit Ethernet cables to front-panel RJ-45 ports
  • Install PMC modules into the mezzanine sites as required by the application
  • Verify backplane slot keying matches the board’s P1/P2 connector configuration

Usage Precautions:

  • Verify backplane compatibility with VME 2eSST signaling for full 320 MB/s performance
  • Ensure operating system and Board Support Package (BSP) compatibility with the MPC864xD dual-core architecture
  • Observe ESD protection protocols during handling and installation
  • Monitor thermal conditions in enclosed chassis to maintain operation within the -40°C to +71°C range
  • Confirm firmware and hardware revision compatibility with existing VMEbus infrastructure before deployment

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