GE IC693CPU351-HT
GE IC693CPU351-HT - Image 2

GE IC693CPU351-HT

Product Overview: The IC693CPU351-HT is a high-temperature rated variant of the IC693CPU351 CPU module, specifically engineered for operation in elevated ambient temperature environments that exceed standard industrial temperature ranges. This module maintains identical processing capabilities, memory capacity, and I/O support as the standard IC693CPU351 while incorporating enhanced thermal management and industrial-grade components selected for reliable operation in challenging thermal conditions. The “-HT” designation signifies the extended temperature specification, making this CPU ideal for installations in hot climates, near heat-generating equipment, or in industrial processes where ambient temperatures routinely exceed 60°C.

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Category: SKU: GE IC693CPU351-HT

Description

GE IC693CPU351-HT

Technical Specifications:

Parameter Specification
Processor Type Intel 80386EX
Processor Speed 25 MHz
User Memory 240 KB (245,760 Bytes) with firmware 9.0 and later
Discrete I/O Points 2,048 Inputs / 2,048 Outputs (4,096 total)
Analog I/O Capacity 32,640 words maximum (each for %AI and %AQ)
Register Memory Up to 32,640 words
Binary Global Memory 1,280 bits
Memory Coils 4,096 bits
Temporary Output Coils 256 bits
System Status References 128 bits
System Registers Up to 28,000 words
Serial Ports 3 built-in ports
Power Supply Voltage 5 Volts DC
Backplane Current Draw 890 milliamps
Typical Scan Rate 0.22 milliseconds per 1K of Boolean logic
Floating-Point Math Supported (firmware 9.0 and later)
Battery-Backed Clock Yes
Timers/Counters More than 2,000
Shift Register Yes
Key Switch Yes
Operating Temperature Extended high-temperature range (exceeds standard 0°C to 60°C)
Weight 0.91 kg (2.01 lbs)
Baseplates per System 8 (1 CPU baseplate + 7 expansion/remote)

Functional Features:

  • High-Temperature Operation: Specifically designed and tested for continuous operation in elevated ambient temperatures beyond the standard 0°C to 60°C range. The exact extended temperature specification is determined by GE Fanuc qualification testing for high-temperature environments.

  • Identical Processing Power: The same 25 MHz Intel 80386EX processor delivers identical computational performance as the standard CPU351, with a 0.22 ms scan rate per 1K Boolean logic.

  • Rugged Component Selection: All electronic components are carefully selected and qualified for extended temperature operation, including capacitors with higher temperature ratings, industrial-grade integrated circuits, and thermal stress-tested solder joints.

  • Enhanced Thermal Management: Improved heat dissipation design including optimized PCB layout, thermal vias, and component placement to maximize heat transfer away from critical components.

  • Full Feature Set: All standard capabilities are preserved, including:

    • 240 KB configurable user memory
    • Floating-point mathematics (firmware 9.0+)
    • Three serial ports with SNP, SNPX, and RTU protocols
    • Battery-backed real-time clock
    • Sequential event recorder
    • Override capability
    • PCM/CCM module support

  • Flash Memory Firmware: Non-volatile storage ensures program retention and enables field firmware upgrades without EEPROM programming equipment.

  • Comprehensive Diagnostics: Built-in self-test routines continuously monitor CPU health, memory integrity, and communication status.

Application Scenarios:

  • Steel Mills and Foundries: Control systems operating near blast furnaces, rolling mills, and casting equipment where ambient temperatures routinely exceed 60°C.

  • Glass Manufacturing: Furnace control, forming machine automation, and annealing lehr control in high-temperature production environments.

  • Chemical Processing: Reactor control, distillation column management, and heat exchanger monitoring in processes with elevated ambient temperatures.

  • Power Generation: Turbine hall control, boiler control systems, and auxiliary equipment in power plants where heat radiation is significant.

  • Cement and Lime Kilns: Kiln control, cooler management, and material handling in high-temperature mineral processing.

  • Outdoor Installations in Hot Climates: Solar power tracking systems, pipeline monitoring, and remote pumping stations in desert or tropical environments.

  • Engine Rooms and Turbine Halls: Marine propulsion control, generator control, and auxiliary machinery in enclosed spaces with limited ventilation.

  • Industrial Ovens and Furnaces: Heat treatment control, baking process automation, and drying system management.

Performance Parameters:

  • Scan Time: 0.22 ms per 1K Boolean logic (typical), identical to the standard CPU351, ensuring no performance degradation in high-temperature environments.

  • Thermal Stability: Processor and memory operate reliably across the extended temperature range with consistent scan times and no thermal throttling.

  • I/O Update Rate: Maintains high-speed I/O performance even at elevated temperatures, supporting critical control loops in thermal processes.

  • Communication Reliability: Serial ports maintain specified baud rates and error-free communication across the full temperature range.

Material Composition:

  • High-Temperature PCB: Multi-layer FR-4 substrate with enhanced glass transition temperature (Tg) rating to prevent PCB warping and delamination at elevated temperatures.

  • Extended Temperature Components: All semiconductors, capacitors, and resistors are industrial-grade or military-grade with temperature ratings significantly exceeding standard commercial specifications.

  • Thermal Interface Materials: Enhanced thermal interface materials between heat-generating components and the PCB to improve heat dissipation.

  • High-Temperature Connector Housing: Thermoplastic housing material with elevated heat deflection temperature to maintain dimensional stability.

  • Thermal Stress-Relieved Solder Joints: Manufacturing process includes thermal cycling to relieve solder joint stress and prevent thermal fatigue failures.

Structural Characteristics:

  • Single-Slot Design: Identical physical dimensions to the standard CPU351, allowing direct replacement in existing installations without mechanical modifications.

  • Enhanced Heat Spreading: PCB design incorporates copper pours and thermal vias to distribute heat evenly across the board surface.

  • Front Panel Interface: Same LED indicators, key switch, and serial port connectors as the standard for consistent user interface.

  • Shield Ground Connection Tab: Dedicated grounding point for EMI protection, critical in high-temperature environments where electrical noise from heating elements is common.

  • Battery Compartment: Accessible battery holder with thermal isolation to protect the lithium battery from excessive heat, extending battery life.

Working Principle:

The IC693CPU351-HT operates on the identical scan-based execution principle as the standard CPU351:

  1. Input Scan: Reads all discrete and analog inputs from I/O modules across the backplane.

  2. Program Execution: The 80386EX processor executes the user program using the same instruction set and memory architecture as the standard CPU351.

  3. Output Update: Writes calculated output states to the I/O modules.

  4. Communication Service: Manages serial port communication and optional network module data exchange.

  5. Housekeeping: Performs diagnostics, updates the real-time clock, and manages memory.

The key difference lies in the thermal design and component qualification. The CPU employs:

  • Thermal Derating Management: Internal monitoring ensures safe operation by managing thermal loads.

  • Extended Temperature Oscillator: Crystal oscillator selected for frequency stability across the extended temperature range.

  • High-Temperature Memory: RAM and Flash memory devices qualified for operation at elevated temperatures.

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