Motorola MVME2700

Product Introduction
The Motorola MVME2700 is a high-performance, double-high 6U VMEbus single-board computer (SBC). Designed for demanding industrial and telecommunications applications, it features a PowerPC architecture and advanced ASIC integration to provide robust processing power, high-speed data throughput, and exceptional reliability in mission-critical environments.

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Description

Motorola MVME2700

Technical Specifications

  • Microprocessor: Powered by the MPC750 PowerPC processor, available in speeds of 233 MHz, 266 MHz, or 366 MHz.
  • Cache Memory: Features 32KB of L1 cache and 1MB of L2 “backside” cache memory for optimized processing performance.
  • Memory: Supports 16MB to 256MB of ECC DRAM via the RAM200 module, with 1MB of base board memory.
  • Storage: Includes 1MB of 16-bit Flash memory on the base board and supports 4MB or 8MB of 64-bit Flash on the RAM200 module.
  • Power Requirements: Operates on +5Vdc (±5%) at 5.5A typical / 6.5A maximum; +12Vdc (±10%) at 250mA typical / 500mA maximum; and -12Vdc (±10%) at 100mA typical / 250mA maximum.

Functional Features

  • Advanced VMEbus Interface: Acts as a VMEbus system controller with support for A24/A32 addressing and D8/D16/D32/D64 block transfers.
  • High-Speed Connectivity: Integrates Ethernet or AUI interfaces, SCSI bus support, and synchronous/asynchronous serial ports.
  • Expansion Capabilities: Features an IEEE P1386.1 PCI Mezzanine Card (PMC) slot for additional I/O or processing expansion.
  • System Management: Includes an 8KB x 8 NVRAM with a Real-Time Clock (RTC) and battery backup, a watchdog timer, and front-panel RESET and ABORT switches.

Application Scenarios

  • Industrial Automation: Serves as a central controller in Distributed Control Systems (DCS) and Programmable Logic Controllers (PLC).
  • Telecommunications: Deployed in network routing, switching infrastructure, and data acquisition systems.
  • Defense & Aerospace: Utilized in ruggedized military computing, radar systems, and flight simulation equipment.

Performance Parameters

  • Operating Temperature: 0°C to 55°C entry air temperature with forced-air cooling.
  • Storage Temperature: -40°C to +85°C for non-operating conditions.
  • Humidity: 5% to 90% relative humidity (non-condensing).
  • Bus Performance: Supports high-speed DMA for fast local memory to VMEbus transfers.

Material Composition
Constructed using high-quality, industrial-grade electronic components, precision printed circuit boards (PCBs), and specialized Application-Specific Integrated Circuits (ASICs). It includes an onboard lithium battery for memory backup.