Motorola MVME51006E

Product Introduction
The MVME51006E is a flagship high-performance VME processor module based on the Motorola PowerPlus II VME Architecture. It delivers supercomputing levels of performance within a single VMEbus slot, specifically engineered to meet the rigorous demands of mission-critical embedded systems in defense, aerospace, and industrial automation.

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Description

Motorola MVME51006E

Technical Specifications

  • Microprocessor: Features MPC7410, MPC750, or MPC755 class microprocessors with 32KB/32KB L1 cache.
  • Cache: Supports up to 2MB of secondary backside cache for enhanced data throughput.
  • Front-Side Bus: Operates on a 100 MHz front-side bus.
  • Memory: Includes up to 512MB of on-board ECC SDRAM, expandable to 1GB using optional RAM500 memory expansion modules.
  • Storage: Provides up to 17MB of Flash memory for firmware and boot storage.

Functional Features

  • High Bandwidth Architecture: Delivers 582MB/s memory read bandwidth and 640MB/s burst write bandwidth.
  • PCI Throughput: Supports full PCI throughput of 264MB/s without starving the processor from memory.
  • Expansion Slots: Features dual IEEE P1386.1 compatible 32/64-bit PMC expansion slots and a 64-bit PCI expansion mezzanine connector allowing up to four additional PMCs.
  • Communication: Equipped with dual 10BaseT/100BaseTX Ethernet ports and dual 16550 compatible async serial ports.
  • System Management: Includes 32KB NVRAM with a replaceable battery backup, four 32-bit timers, one watchdog timer, and an on-board debug monitor.

Application Scenarios
Extensively deployed in defense and aerospace systems, industrial automation, semiconductor process equipment, and medical imaging devices requiring extreme reliability and high computational power.

Performance Parameters

  • Operating Temperature: 0°C to 55°C (commercial) and -20°C to 71°C (industrial extended).
  • Storage Temperature: -40°C to +85°C.
  • Relative Humidity: 5% to 90% non-condensing.
  • Cooling Requirement: 400 LFM (Linear Feet per Minute) forced air cooling recommended for upper temperature ranges.

Material Composition
Constructed with high-Tg industrial-grade multi-layer PCBs, featuring gold-plated VME edge connectors and protective conformal coating to withstand harsh environmental conditions.

Structural Characteristics
Standard 6U VME form factor with physical dimensions of 233.4 mm (height) by 160 mm (depth). It occupies a single VME slot even when fully configured with two PMC modules and add-on memory mezzanines.