Motorola MVME61006E-0161R

Motorola MVME61006E-0161R

Product Introduction
The MVME61006E-0161R is the ruggedized variant of the 0161 enhanced model. The “R” suffix indicates that this board has been specifically engineered and tested to withstand extreme mechanical shock, vibration, and wide temperature ranges, making it perfect for mobile and tactical defense applications.

Request Quote
Category:

Description

Motorola MVME61006E-0161R

Technical Specifications

  • Processor: 1.267 GHz MPC7457 PowerPC.
  • Memory: 512 MB ECC DDR DRAM.
  • Storage: 128 MB Flash.
  • Networking: Dual Gigabit Ethernet.

Functional Features

  • Ruggedized Design: Reinforced PCB mounting and conformal coating for extreme environments.
  • Conduction Cooling Ready: Designed to interface with chassis conduction cooling wedgelocks (if equipped with appropriate mechanical kit).
  • Enhanced Testing: Passes rigorous MIL-STD vibration and shock profiles.

Application Scenarios
Tactical military vehicles, naval shipboard computing, airborne reconnaissance systems, and mobile command centers.

Performance Parameters

  • Operating Temperature: Extended temperature range capability (typically -40°C to +85°C component level).
  • Vibration Tolerance: Rated for high-G random vibration and shock.
  • Bandwidth: 320 MB/s VME 2eSST.

Material Composition
Utilizes high-reliability, extended-temperature-grade components. PCBs are manufactured with high-Tg materials and specialized surface finishes to prevent solder joint fatigue under vibration.

Structural Characteristics

  • Mechanical Reinforcement: Additional standoffs and adhesive underfill on critical BGA components.
  • Thermal Interface: Top-side thermal pads or wedgelock mounting points for conduction-cooled chassis.
  • Protected Connectors: Ruggedized front-panel connectors with enhanced strain relief.

Working Principle
Operates identically to the standard 0161 model but with firmware and hardware tuned to manage thermal throttling and error correction in extreme conditions without failing.

Installation Requirements

  • Must be installed in a chassis that provides adequate conduction cooling or high-velocity forced air.
  • Ensure wedgelock mechanisms are properly torqued to the chassis guides.
  • Verify that the power supply can handle the inrush current in cold-start conditions.

Usage Precautions

  • Never operate outside the specified temperature envelope.
  • Inspect wedgelocks and connectors regularly for signs of mechanical wear or corrosion.
  • Avoid rapid thermal cycling which can induce mechanical stress on solder joints.

Related products