Description
Motorola MVME61006E-0173R
Technical Specifications
- Processor: 1.267 GHz NXP (Motorola) MPC7457 PowerPC with AltiVec coprocessor.
- System Memory: 1 GB of ECC-protected DDR DRAM.
- Flash Storage: 128 MB of Intel StrataFlash with hardware write-protection.
- Network Interfaces: Dual 10/100/1000 Mbps Gigabit Ethernet ports.
- VME Bridge: Tsi148 ASIC supporting 2eSST protocol at up to 320 MB/s.
Functional Features
- Extreme Ruggedization: Engineered to survive high-G shock, random vibration, and extreme thermal cycling without performance degradation.
- Enhanced Reliability: Subjected to rigorous extended burn-in testing and premium component screening.
- Conduction Cooling Ready: Designed with specialized thermal pads and mounting points to interface with chassis wedgelocks for sealed-enclosure cooling.
- Fail-Safe Boot: Dual-bank flash memory with switch-selectable boot banks ensures system recovery even if primary firmware is corrupted.
Application Scenarios
Ideal for tactical military vehicles, naval shipboard combat systems, airborne reconnaissance platforms, and heavy-duty mobile industrial equipment operating in uncontrolled environments.
Performance Parameters
- VME Bandwidth: 320 MB/s actual throughput via 2eSST protocol.
- Memory Bus: 133 MHz system bus providing over 2 GB/s local memory bandwidth.
- Environmental Tolerance: Rated for extreme operating temperatures, typically -40°C to +85°C at the component level.
Material Composition
Constructed with high-Tg, multi-layer industrial-grade PCBs. Critical BGA components utilize specialized underfill adhesives to prevent solder joint fatigue under vibration. The board features a thick conformal coating to protect against salt spray, humidity, and conductive dust.
Structural Characteristics
- Mechanical Reinforcement: Enhanced ejector/lever mechanisms with positive locking to prevent board unseating during high-impact events.
- Thermal Interface: Integrated top-side thermal pads and reinforced mounting points for direct heat transfer to conduction-cooled chassis.
- Ruggedized I/O: Front-panel RJ-45 and serial connectors feature enhanced strain relief and mechanical shielding.
Working Principle
Upon power-up, the MPC7457 processor initializes the 1 GB DDR memory via the MV64360 system controller. The MOTLoad firmware performs comprehensive hardware diagnostics, including memory scrubbing. The Tsi148 VME bridge then establishes high-speed 2eSST communication with the backplane, while the AltiVec coprocessor accelerates vector-based signal processing tasks.
Installation Requirements
- Must be installed in a compatible ruggedized VME chassis that provides proper wedgelock interfaces or high-velocity forced-air cooling.
- Ensure all mechanical fasteners and wedgelocks are torqued to the manufacturer’s exact specifications.
- Strictly observe ESD protocols during handling to prevent damage to sensitive internal components.
