Description
ABB PM665 3BDS005799R1
Technical Specifications:
- Series: AC500-eCo.
- Integrated I/O: Built-in digital inputs and outputs.
- Communication: Integrated serial and optional Ethernet communication.
- Programming: Fully compatible with IEC 61131-3 standard.
Functional Features:
- All-in-One Design: Combines CPU, I/O, and communication to reduce panel space and wiring.
- Cost Efficiency: Optimized for applications requiring fewer I/O points without sacrificing core PLC functionality.
- Expandability: Can be expanded with additional AC500-eCo or standard S500 modules if needed.
- User-Friendly: Simplified configuration and programming via Automation Builder.
Application Scenarios:
- Small machinery and OEM equipment.
- Simple conveyor and material handling systems.
- Packaging and labeling machines.
- Remote pumping and monitoring stations.
Performance Parameters:
- Scan Time: Fast cyclic processing for responsive control.
- Memory: Adequate program and data memory for compact applications.
- Power Consumption: Low power draw suitable for limited power supplies.
Material Composition & Structural Characteristics:
- Housing: Space-saving plastic enclosure.
- Terminals: Removable screw terminal blocks for fast field wiring.
- Connectors: Integrated communication ports on the front panel.
Working Principle:
The PM665 operates similarly to a standard PLC but integrates the I/O directly onto the CPU board. It scans local inputs, executes logic, and updates local outputs in a single cyclic scan. Communication is handled via the integrated ports, allowing it to act as a standalone controller or a remote I/O node.
Installation Requirements:
- Mounting: DIN rail mountable with secure locking mechanisms.
- Wiring: Connect field devices directly to the onboard terminals.
- Power: Provide stable 24 V DC power.
- Software: Configure hardware and program logic using Automation Builder.
Usage Precautions:
- I/O Limits: Do not exceed the maximum current rating per output or total module current.
- Heat Dissipation: Ensure proper airflow as integrated I/O generates localized heat.
- Grounding: Properly ground the module to prevent electrical noise interference.
- Expansion: Verify compatibility before adding expansion modules.




