Description
Bently 1900/65‑00‑01‑03‑00‑01
- Technical Specifications
- Physical Mounting Form: Standard 35 mm DIN‑rail mounting, cabinet‑only installation
- Dynamic Transducer Input Channels: 4 multi‑configurable dynamic input channels
- Temperature Input Channels: 4 temperature measurement channels
- Supported Dynamic Sensor Types: Eddy‑current proximity probe, IEPE accelerometer, two‑wire velocity transducer
- Supported Temperature Sensor Types: Type J, K, E, T thermocouple; 2‑wire and 3‑wire Pt100 RTD
- Relay Outputs: 6 programmable electromechanical relay outputs, support trip‑relay latching function
- Relay Contact Rating: 5 A @250 VAC resistive load
- Analogue Recorder Output: 4 channels galvanically‑isolated 4‑20 mA output
- Buffered Sensor Output: BNC buffered raw dynamic signal output for portable diagnostic instrument connection
- Communication Interface: RS‑485 Modbus RTU
- Power Supply Requirement: 24 VDC nominal, operating range 18 VDC ~ 30 VDC
- Operating Ambient Temperature Range:‑30 °C ~ +65 °C
- Storage Temperature Range:‑40 °C ~ +85 °C
- Enclosure Protection Grade: IP20, for installation inside closed electrical cabinet only
- Front‑Panel Display Option: No attached local display
- Functional Features: All channel sensor type, measurement unit, alarm threshold, alarm time‑delay and relay logic parameters can be fully configured via dedicated PC configuration software without hardware modification. Every measurement channel has independent Alert and Danger programmable threshold with adjustable hysteresis and time‑delay setting to suppress false alarms caused by transient signal spikes. Trip‑associated relay supports configurable self‑locking latching function; relay status maintains after danger‑trip event until manual reset command is sent via software or remote Modbus command. Built‑in event log stores large‑volume timestamped records for alarm events, danger trip events, sensor fault status, relay latch status and module power‑cycle records. BNC buffered raw sensor output allows on‑site spectrum and waveform diagnosis without disconnecting field sensors. Integrated hardware fault‑diagnosis function can detect sensor open‑circuit fault, short‑circuit fault and power‑supply abnormality. Galvanically‑isolated 4‑20 mA analogue outputs effectively reduce ground‑loop interference risk between field sensors and upper‑level control system. Modbus RTU communication transmits vibration amplitude, temperature value, alarm status, latch‑trip status and fault diagnostic information to plant DCS, PLC and SCADA system. Relay contact supports normally‑open and normally‑closed configurable mode for flexible interlock circuit design. This variant has no local front‑panel display; all parameter configuration and status reading must be completed via PC software or Modbus remote access.
- Application Scenarios: Condition monitoring and machinery protection for auxiliary rotating equipment including centrifugal pumps, fans, blowers, small‑frame compressors and gearboxes, where trip‑relay self‑locking safety‑interlock function is required. Widely deployed in thermal‑power‑plant auxiliary system, water‑treatment plant, paper mill and general heavy‑industry facilities. Suitable for non‑critical rotating assets requiring local self‑locking relay interlock protection together with remote data transmission to central control system. Installed inside closed general‑purpose electrical cabinets in non‑hazardous industrial zones.
- Performance Parameters: Dynamic signal sampling capability supports vibration frequency analysis up to 10 kHz. Sensor fault detection response time is less than 200 ms. 4‑20 mA analogue output full‑scale accuracy reaches ±0.15 %. Galvanic isolation exists between field input circuit, analogue output circuit and communication port to suppress ground‑loop noise interference. Non‑volatile memory retains all user‑configuration parameters, historical event log and relay latch‑status data when module power supply is lost. Each channel supports independent alarm time‑delay setting to avoid false tripping caused by transient signal disturbance. Latching relay status will not automatically reset after trip event, must receive explicit reset command.
- Material Composition: Module housing is made of flame‑retardant industrial thermoplastic material. Detachable screw terminal blocks adopt high‑conductivity copper alloy contact pieces. Multi‑layer industrial‑grade printed circuit board integrates signal‑conditioning circuit, surge‑protection components, micro‑processor and communication driving circuit. Internal passive heat‑dissipation framework ensures stable heat dissipation without cooling fan.
- Structural Characteristics: Slim rectangular DIN‑rail housing structure. Front panel is equipped with power‑supply LED indicator, channel alarm LED indicators and module fault LED indicators; no local digital display screen. Front‑side dedicated configuration port for PC configuration tool connection. Multiple detachable screw terminal blocks are arranged separately for sensor signal input, relay output, analogue signal and DC power‑supply wiring. Ventilation slots are distributed at top and bottom edge of housing for passive natural heat dissipation. No built‑in cooling fan, fully passive cooling design.
- Working Principle: Field‑installed sensors transmit analogue vibration and temperature signals into monitor input terminals. Internal circuit completes signal conditioning, anti‑aliasing filtering and analogue‑to‑digital conversion. On‑board micro‑processor executes real‑time calculation for vibration amplitude and temperature measured value. Measured process values are continuously compared with user‑configured Alert and Danger threshold set‑points. When measured value exceeds threshold and lasts longer than programmed time‑delay period, corresponding relay output will be activated. If relay latching function is enabled, trip‑relay will keep latched status after danger‑trip condition occurs, waiting for software‑triggered reset command. Process measurement values are converted to isolated 4‑20 mA analogue signal and Modbus digital register data, then transmitted outward to upper‑level control system. Built‑in diagnostic algorithm continuously monitors input‑signal quality to identify sensor wiring fault and module internal hardware abnormality, and outputs corresponding fault‑status flag.
- Installation Requirements: Install this monitor module inside closed electrical control cabinet, ambient temperature must remain within rated operating temperature range. Maintain sufficient upper and lower clearance for natural ventilation and heat dissipation. Low‑level sensor signal cables must be physically separated from high‑voltage power cables to minimize electromagnetic interference. All transducer input wiring must adopt shielded twisted‑pair industrial cable. 24 VDC DC power‑supply source must have good ripple‑filtering performance. Complete full‑parameter configuration via PC configuration software before connecting field‑site sensors; configure relay latching‑logic parameter according to site safety‑interlock requirement. Verify relay contact load rating matches interlock‑circuit actual‑load requirement. Cabinet protective earth connection must be reliable and well‑implemented.
- Usage Notes: Module enclosure is IP20 rated; it is strictly forbidden to install outside closed electrical cabinet. Do not exceed rated maximum electrical load of relay contacts. Must confirm software‑channel‑configuration setting matches physical connected sensor type; wrong configuration will produce incorrect measurement reading. When latching trip‑relay function is enabled, site operation procedure shall define explicit reset‑operation workflow after trip event. For Modbus‑communication cable, connect cable shield layer to single‑point earth only. Periodically download event‑log data during equipment‑overhaul cycle for historical abnormal‑event trace analysis. Do not perform hot‑swap‑wiring operation when module is under powered‑on status. This variant does not support local on‑site‑parameter modification without PC‑configuration tool.
