Description
Brooks Automation 001-4130-03
Technical Specifications:
- Brand: Brooks Automation
- Model: 001-4130-03
- Product Series: VCE Series
- Alignment Accuracy: ±2μm (X/Y axes) and ±0.1 mrad (θ axis)
- Repeatability: 0.5μm (X/Y axes) and 0.05 mrad (θ axis)
- Scan Range: ±20mm (X/Y axes) and ±5° (θ axis)
- Control Precision: Nanometer-level with an error margin of ±0.1μm
Functional Features:
- Sub-Micron Positioning: Employs high-precision servo motors and encoders to guarantee nanometer-level alignment accuracy.
- Rapid Dynamic Response: Capable of completing alignment operations in as fast as 1 second, adapting seamlessly to high-speed production rhythms.
- High Reliability & Redundancy: Features a redundant design including dual power supplies and dual communication links, ensuring continuous operation even if a single component fails.
- User-Friendly Integration: Supports multiple sensor and actuator interfaces, providing seamless connectivity with wafer transfer systems and lithography equipment.
Application Scenarios:
Widely utilized in semiconductor manufacturing processes including wafer cleaning, photolithography, etching, deposition, Chemical Mechanical Polishing (CMP), testing, and packaging. It is also applied in solar cell manufacturing, LED chip alignment, and other precision engineering fields.
Performance Parameters:
- Control Speed: X/Y axes at 100mm/s and θ axis at 10°/s
- Load Capacity: 5 kg
- Operating Temperature Range: -40°C to +85°C
- Protection Level: Shockproof, dustproof, and moisture-resistant
Material Composition:
Constructed with industrial-grade high-reliability electronic components and precision mechanical assemblies. The robust housing is designed to withstand extreme temperatures and harsh cleanroom environments.
Structural Characteristics:
Features a highly integrated modular design that facilitates easy installation, maintenance, and upgrades. It is equipped with multiple input/output interfaces to support real-time data processing and provides an intuitive user interface.
Working Principle:
The controller acquires real-time positional feedback from high-precision sensors and executes advanced positioning algorithms. It then drives servo actuators to make micro-adjustments in the X, Y, and θ axes, ensuring the wafer is perfectly aligned before processing.
Installation Requirements:
Must be installed in a stable, vibration-free environment. Ensure all communication and power interfaces are securely connected and properly shielded to prevent signal interference.
Usage Precautions:
Always follow strict Electrostatic Discharge (ESD) protocols during handling. Regularly monitor the self-diagnostic logs and verify that redundant systems are functioning correctly to maintain high availability.
