Description
ICS Triplex T8300
Technical Specifications 6U‑height‑19‑inch‑rack‑mount‑chassis;‑two‑dedicated‑expander‑processor‑slots‑and‑twelve‑I/O‑module‑slots‑in‑total;‑triplicated‑Inter‑Module‑Bus‑backplane;‑dual‑redundant‑24 VDC‑power‑input;‑operating‑temperature‑0 °C‑~‑+60 °C;‑protection‑rating‑IP20;‑backplane‑DIP‑switch‑for‑chassis‑ID‑setting;‑mechanical‑slot‑keying‑prevents‑wrong‑module‑insertion.
Functional Features Integrated‑triplicated‑TMR‑backplane‑realizes‑fault‑tolerant‑signal‑exchange‑between‑expander‑processor‑and‑each‑I/O‑slot;‑backplane‑implements‑redundant‑power‑distribution‑to‑all‑module‑slots;‑supports‑hot‑swap‑of‑I/O‑modules‑without‑system‑shutdown;‑mechanical‑keying‑structure‑blocks‑incompatible‑modules‑from‑being‑inserted‑into‑slots;‑backplane‑DIP‑switch‑sets‑unique‑chassis‑identification‑address;‑hardware‑diagnostic‑signals‑are‑transmitted‑to‑controller‑through‑triplicated‑bus.
Application Scenarios Large‑scale‑petrochemical‑SIS‑system‑I/O‑capacity‑expansion;‑ESD‑emergency‑shutdown‑system‑multi‑chassis‑hardware‑networking;‑fire‑and‑gas‑safety‑control‑system‑distributed‑I/O‑expansion;‑power‑plant‑auxiliary‑equipment‑safety‑protection‑system‑expander‑chassis‑deployment.
Performance Parameters Backplane‑bus‑transmission‑rate‑250 Mbps;‑backplane‑channel‑isolation‑voltage‑500 VAC;‑hardware‑diagnostic‑coverage‑meets‑SIL 3‑index;‑supports‑up‑to‑8‑expander‑chassis‑cascading‑per‑Trusted‑system.
Material Composition High‑strength‑aluminum‑alloy‑chassis‑frame,‑FR‑4‑high‑reliability‑triplicated‑backplane‑printed‑circuit‑board,‑gold‑plated‑high‑reliability‑backplane‑connectors,‑metal‑reinforced‑rack‑mount‑brackets,‑flame‑retardant‑plastic‑mechanical‑key‑components,‑metal‑power‑input‑terminals.
Structural Characteristics Standard‑19‑inch‑6U‑rack‑mount‑metal‑chassis‑structure;‑rear‑panel‑equipped‑with‑dual‑redundant‑power‑input‑connectors;‑internal‑backplane‑integrates‑triplicated‑Inter‑Module‑Bus‑circuit;‑front‑side‑slot‑opening‑for‑direct‑plug‑in‑of‑processor‑and‑I/O‑modules;‑each‑slot‑is‑equipped‑with‑mechanical‑anti‑mismatch‑key‑structure;‑DIP‑setting‑switches‑are‑located‑on‑chassis‑rear‑backplane‑area.
Working Principle Dual‑redundant‑24 VDC‑power‑supply‑is‑input‑to‑chassis‑rear‑terminals‑and‑distributed‑to‑each‑module‑slot‑through‑backplane‑power‑circuit.‑Triplicated‑backplane‑bus‑completes‑fault‑tolerant‑data‑exchange‑between‑expander‑processor‑and‑each‑I/O‑module.‑Backplane‑DIP‑switch‑defines‑unique‑hardware‑address‑for‑expander‑chassis.‑Mechanical‑key‑structure‑physically‑blocks‑insertion‑of‑incompatible‑module‑types.
Installation Requirements Install‑chassis‑into‑19‑inch‑standard‑industrial‑control‑cabinet‑rack;‑reserve‑upper‑and‑lower‑ventilation‑clearance‑for‑heat‑dissipation;‑connect‑dual‑redundant‑24 VDC‑power‑supply‑from‑independent‑power‑sources;‑chassis‑metal‑frame‑must‑reliably‑connect‑to‑cabinet‑protective‑ground‑bar;‑set‑unique‑chassis‑ID‑via‑backplane‑DIP‑switch‑before‑power‑on;‑follow‑hot‑swap‑operating‑procedures‑strictly‑during‑module‑replacement.
Usage Notes Keep‑input‑DC‑voltage‑within‑18‑32 VDC‑range;‑do‑not‑operate‑chassis‑with‑outer‑metal‑housing‑removed;‑only‑Trusted‑compatible‑modules‑can‑be‑inserted‑into‑slots;‑avoid‑condensation‑and‑corrosive‑gas‑accumulation‑inside‑cabinet;‑periodically‑check‑tightness‑of‑power‑input‑terminals;‑do‑not‑disassemble‑backplane‑components‑under‑power‑on‑condition.
