Description
Motorola MVME2400-0361
Technical Specifications: Form factor: 6U VME single slot board Processor: MPC60x series PowerPC processor On-board memory: Maximum 256MB ECC SDRAM Non-volatile storage: On-board boot flash memory Bus bridge: Universe II VME to PCI bridge, compatible with VME64 Expansion interface: Dual independent PMC mezzanine slots, 64-bit PCI bus up to 66MHz Communication: Dual Ethernet interfaces available via PMC card installation Operating temperature range: 0℃ ~ +60℃ Storage temperature range: -40℃ ~ +85℃ Protection grade: IP20 inside VME chassis
Functional Features: High performance PowerPC processor for real-time heavy-duty computing tasks. Universe II bridge chip realizes programmable address mapping between VME bus and PCI bus. Dual PMC slots support installation of multiple mezzanine cards for custom I/O and network expansion. ECC memory function to detect and correct single bit memory error automatically. Comprehensive error reporting for memory fault, bus error and peripheral communication abnormality. Support CHRP compliant firmware boot for embedded operating system loading. VME bus master and slave capability for data exchange with other VME modules. On-board firmware supports power-on self-test and system diagnostic function.
Application Scenarios: High-speed industrial data acquisition system, radar signal pre-processing, industrial machine vision control platform, hardware-in-loop simulation test equipment, semiconductor production line control, transportation embedded control, legacy VME system upgrade projects.
Performance Parameters: High bandwidth 64-bit PCI bus for PMC expansion data transmission. VME64 high speed block data transfer between VME chassis modules. ECC memory protection ensures data integrity during long time continuous operation. Continuous running capacity: 24 hours uninterrupted operation under proper cooling condition. Firmware self-test detects hardware fault immediately after power on.
Material Composition: PCB substrate: Multi-layer FR4 high reliability glass fiber epoxy printed circuit board. Core electronic components: PowerPC processor, ECC SDRAM chips, flash memory, Universe II VME bridge chip. Front panel: Machined aluminum alloy front panel with external connectors and LED indicators. Heat dissipation component: Aluminum extruded heat sink mounted on processor. VME edge connector: Gold plated copper alloy edge pins. PMC connectors: Gold plated multi-layer PCB mezzanine connectors.
Structural Features: Standard 6U VME single slot rectangular plug-in board. Aluminum front panel reserves installation position for PMC external I/O connectors and status LEDs. Processor equipped with large aluminum passive heat sink. Internal circuit divided into core processor area, memory bank, PCI bus area, VME bridge area and dual PMC connector area. Gold plated VME edge connector connects to VME chassis backplane for power and bus signal. Dual PMC vertical connectors allow stacking of two mezzanine expansion cards.
Working Principle: After VME chassis power up, firmware stored in on-board flash runs power-on self-test for processor, memory and bus circuit. PowerPC processor loads embedded operating system and user application software. Universe II bridge chip completes address translation and data forwarding between local PCI bus and VME backplane bus. The board can act as VME master to initiate bus read and write access, or respond as VME slave to access request from other VME master boards. PMC mezzanine cards connect to local PCI bus to expand network, serial or analog I/O functions. ECC circuit monitors memory data and correct single bit memory error automatically.
Installation Requirements: Cut off VME chassis power before board installation or removal. Insert MVME2400-0361 into empty 6U VME slot and tighten front panel mounting screws. Install PMC mezzanine cards before closing chassis cover. Configure firmware boot parameters via serial debug port before commissioning. VME chassis must be reliably connected to protective earth ground. Ensure chassis cooling fan delivers sufficient airflow across processor heat sink. Set PCI clock parameter to match PMC card specification to avoid bus communication failure.
Usage Notes: Hot swap is strictly forbidden when VME chassis is powered on. Backup firmware and application image before hardware modification or firmware update. Do not touch gold-plated VME edge contacts with bare hands. Wear anti-static wristband when handling bare board and PMC cards. Regularly clean dust accumulated on heat sink and chassis filter. Inspect front panel connector wiring tightness periodically. Disconnect chassis power before installing or removing PMC mezzanine modules.
