Motorola MVME2700-1221

roduct Introduction
The Motorola MVME2700-1221 is a specific configuration variant of the MVME2700 series, optimized for particular industrial OEM applications with tailored memory, processor speed, and I/O settings. It maintains full compatibility with the MVME2700 architecture while offering customized specifications.

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Description

Motorola MVME2700-1221

Technical Specifications

  • Microprocessor: PowerPC MPC750 processor at a specific clock speed based on the 1221 configuration.
  • Memory: Configurable ECC DRAM via the RAM200 module.
  • Storage: 1MB of 16-bit Flash memory on the base board.
  • Power Requirements: Standard VME power rails (+5Vdc, +12Vdc, -12Vdc) with strict tolerance levels.

Functional Features

  • Custom Configuration: Tailored memory and processor speed for specific application requirements.
  • VMEbus Compliance: Full support for VMEbus system controller functions and block transfers.
  • Real-Time Capabilities: Features programmable timers, interval counters, and a hardware watchdog for precise real-time task management.

Application Scenarios

  • OEM Equipment: Custom industrial machinery and embedded systems.
  • Legacy Replacement: Direct upgrade path for older MVME167/172 systems.
  • Data Acquisition: Multi-channel sensor data collection and processing.

Performance Parameters

  • Operating Temperature: 0°C to 55°C with forced-air cooling.
  • Storage Temperature: -40°C to +85°C.
  • Humidity: 5% to 90% non-condensing.

Material Composition
Industrial-grade electronic components on UL-recognized PCB with battery-backed NVRAM module.

Structural Characteristics

  • Form Factor: Double-high 6U VMEbus.
  • Dimensions: Standard VME 6U mechanical footprint.

Working Principle
Executes instructions via PowerPC processor with memory management handled by advanced ASICs and VMEbus interfacing via dedicated bridge controllers.

Installation Requirements

  • Requires standard 6U VME chassis with adequate cooling.
  • Proper grounding to backplane is essential for signal integrity.

Usage Precautions

  • Observe ESD precautions during handling.
  • Verify configuration matches application requirements before deployment.
  • Ensure adequate airflow across the board surface.