Description
Motorola MVME2700-1231
Technical Specifications
- Processor: 233 MHz MPC750-class 32-bit microprocessor
- L1 Cache: 32KB instruction cache / 32KB data cache
- L2 Cache: 1MB backside cache
- Memory: 32MB ECC DRAM
- Flash Memory: 9MB on-board Flash
- VMEbus Interface: Full VME64 master/slave interface
- I/O Transition Module: MVME761
- Front Panel: IEEE 1101 compatible with injector/ejector handles
- Serial Ports: Two or three asynchronous, one or two synchronous/asynchronous serial ports
- Ethernet: 10BaseT/100BaseTX with 32-bit PCI local bus DMA
- SCSI: 8-bit or 16-bit Fast SCSI-2 bus interface
- NVRAM: 8KB with replaceable battery-backed real-time clock
- Timers: Four 32-bit timers plus one watchdog timer
- PMC Expansion: IEEE P1386.1 compatible 32/64-bit PMC slot
Key Features
- Motorola PowerPlus Architecture with proprietary ASICs
- 1MB backside L2 cache for significantly reduced memory latency
- ECC DRAM with real-time error detection and correction
- On-board debug monitor with comprehensive self-test diagnostics
- MVME761 I/O transition module for rich external connectivity
- IEEE 1101 front panel for easy installation and maintenance
- Single VME slot operation even with PMC module installed
- Raven PCI-MPU bridge controller for optimized system mapping
Application Scenarios Industrial automation control systems, military communication terminals, aerospace data processing units, telecommunications signaling equipment, medical device controllers, test and measurement instruments, embedded network infrastructure
Performance Parameters
- Processor Clock: 233 MHz
- L1 Cache: 32KB + 32KB
- L2 Cache: 1MB backside
- Memory: 32MB ECC DRAM
- Flash: 9MB
- Ethernet: 10/100Base-TX
- SCSI: Fast SCSI-2
- Serial: Async/sync configurable
- NVRAM: 8KB with TOD clock
Material Composition Industrial and military-grade multi-layer printed circuit board. The MPC750 processor and L2 cache chips utilize high-performance ceramic or enhanced plastic packaging. All connectors feature military-specification gold-plating for maximum reliability in harsh environments. The IEEE 1101 front panel is constructed from aircraft-grade aluminum with anodized finish.
Structural Characteristics Standard 6U VME form factor measuring 233mm x 160mm. The IEEE 1101 compatible front panel includes injector/ejector handles for rapid installation and removal from VME chassis. Board-mounted LEDs provide visual indication of power, status, and fault conditions. A 190-pin DRAM mezzanine connector (J6) supports future memory upgrades. Four 64-pin PCI mezzanine card connectors (J11-J14) enable PMC expansion.
Working Principle The MPC750 processor executes PowerPC instructions through its superscalar pipeline architecture. The 32KB/32KB L1 cache provides immediate access to frequently used instructions and data, while the 1MB backside L2 cache reduces main memory access latency. The Raven PCI-MPU bridge ASIC optimizes memory mapping and system configuration. The Universe ASIC manages VME64 bus protocols, supporting A16-A32 addressing and D08-D64 data transfers with block transfer capabilities. The Winbond W83C553 PCI-ISA bridge handles legacy I/O integration.
Installation Requirements Standard VME64 chassis with adequate cooling capacity for sustained 233 MHz operation. The MVME761 transition module requires proper P2 backplane connectivity. Power requirements include +5V DC, +12V DC, and -12V DC from the VMEbus backplane. Ensure chassis grounding is properly established before installation.
Usage Notes Monitor ECC memory error counts through the on-board diagnostic firmware. The lithium battery for NVRAM and real-time clock requires periodic replacement. When installing PMC modules, ensure proper alignment with the four 64-pin connectors. SCSI bus termination must be properly configured based on system topology. The PPCBug firmware provides comprehensive debugging and system evaluation capabilities.
