Description
Motorola MVME31006E-1263
Technical Specifications
- Processor: NXP MPC8540 PowerQUICC III with PowerPC e500 core running at 667 MHz.
- Memory: Supports up to 256MB DDR333 ECC memory via a single SODIMM socket.
- Storage: Integrated Serial ATA (SATA) controller and up to 256MB onboard Flash.
- Connectivity: Dual 10/100/1000 Gigabit Ethernet ports and one 10/100 BaseTX port.
Functional Features
- High-Bandwidth Bus: Supports 2eSST VMEbus protocol providing up to 320MB/s bandwidth.
- Expansion Capabilities: Features dual 33/66/100MHz PMC-X sites for industry-standard module expansion.
- Peripheral Integration: Includes USB 2.0, multiple serial ports, and SATA for cost-effective storage.
- OS Support: Comprehensive board support packages for VxWorks, LynxOS, and Linux.
Application Scenarios
Extensively utilized in distributed control systems (DCS), telecommunications routing, medical imaging equipment, and aerospace test platforms.
Performance Parameters
- VME Bandwidth: 2eSST protocol achieves 320MB/s, eight times the bandwidth of standard VME64.
- Operating Temperature: Rated for 0°C to 55°C.
- Backward Compatibility: Maintains full compatibility with VME64 and VME32 standards.
Material Composition
Constructed with high-Tg, UL94V-0 flame-retardant industrial-grade PCBs, utilizing high-reliability BGA processors and industrial-grade DDR memory modules.
Structural Characteristics
Standard single-slot 6U VME form factor. Supports front panel I/O and rear I/O routing via a dedicated Rear Transition Module (RTM).
Working Principle
The MPC8540 System-on-Chip integrates the processor core, memory controller, DMA engine, and PCI-X interface. It communicates with the VME backplane via the Tundra Tsi148 VMEbus bridge, translating local PCI-X transactions to 2eSST VME transactions.
Installation Requirements
Must be inserted into a standard 6U VME chassis backplane. Ensure P1 and P2 connectors are fully aligned and locked. If rear I/O is required, install the corresponding RTM (e.g., MVME721).
Usage Precautions
Never hot-swap the board. Always use an ESD wrist strap during handling. Ensure adequate forced-air cooling to maintain temperatures below 55°C.
