Description
Motorola MVME8100-202200401E
Technical Specifications
- Processor: Dual-core Freescale QorIQ P5020 Power Architecture (e5500 cores).
- Memory: High-capacity DDR3 ECC SDRAM memory controllers.
- Storage: Integrated NAND Flash memory in eMMC format.
- Connectivity: Five Gigabit Ethernet controllers (SGMII and RGMII interfaces).
Functional Features
- Advanced Interconnects: Features Serial RapidIO (SRIO) v1.3-compliant ports and dual PCI Express controllers for high-bandwidth peripheral communication.
- Enhanced I/O: Includes two 4-pin UARTs, four I2C controllers, two 4-channel DMA engines, and dual high-speed USB 2.0 controllers.
- Hardware Security: Supports enhanced secure digital host controllers and secure boot mechanisms.
Application Scenarios
Deployed in advanced C4ISR systems, radar and sonar signal processing, semiconductor lithography equipment, and high-end military automation platforms.
Performance Parameters
- Bus Architecture: Fully compliant with VMEbus, 2eSST, and PCI-X standards for maximum backplane interoperability.
- Data Integrity: Dual 64-bit DDR3/3L SDRAM memory controllers with ECC ensure zero data corruption during intensive operations.
Material Composition
Constructed with high-Tg, multi-layer industrial-grade PCBs. The eMMC NAND Flash and processor are rated for extreme operating temperatures, typically -40°C to +85°C, with specialized storage limits reaching -55°C to +105°C.
Structural Characteristics
- Form Factor: Standard 6U VME/VXS mechanical envelope.
- Ruggedization: Designed to withstand severe vibration (up to 10G sine) and shock (40g/11ms) in its enhanced variants.
- Environmental Protection: Optional acrylic conformal coating to protect against high humidity, condensation, and conductive dust.
Working Principle
The dual-core P5020 processor orchestrates massive data flows through the DDR3 memory controllers and high-speed SRIO/PCIe links. The Tsi148 or equivalent VME bridge translates these high-speed local bus transactions into standardized VME 2eSST signals, enabling seamless communication with legacy backplane modules.
Installation Requirements
- Must be installed in a compatible 6U VME or VXS chassis.
- Ensure the board is completely dry and free of moisture before applying power to prevent short circuits.
- Securely engage the ejector levers to guarantee proper mating with the backplane connectors.
Usage Precautions
- Strictly observe the specified environmental limits; do not operate outside the validated temperature and humidity ranges.
- Note that while the board supports extreme storage temperatures, the eMMC flash warrants optimal data retention performance strictly between -40°C and +85°C.




