Description
TEWS TIP114-10R
Technical Specifications
- Product type: IndustryPack mezzanine module
- Form factor: 3U / 6U IndustryPack
- I/O: Analog / digital channels
- Interface: IndustryPack bus
- Supply: From carrier
- Operating temperature: -40 °C to +85 °C
- Storage temperature: -55 °C to +100 °C
- Humidity: 5 % to 95 %, non-condensing
- Protection: IP20 board level
- Mounting: Carrier stack
- Connectors: Header
- Channels: Per I/O type
Functional Features
- IndustryPack standard mezzanine
- Wide temperature range
- Multi-channel I/O
- On-board calibration
- GPIO / interrupt
- Carrier independent
- Compact size
- Industrial grade
- Conformal coated option
- Long availability
Application Scenarios
- VME test system I/O
- CompactPCI data acquisition
- Aerospace ground test
- Rack instrument
- Research platform
Materials and Construction
- PCB: FR4 wide temp
- Chip: ADC / DAC / GPIO
- Connector: 50 pin header
- Components: Industrial grade
- No housing
- Conformal coating option
Structural Features
- Small IndustryPack PCB
- 50 pin header
- On-board I/O circuits
- Solder to carrier
- Compact
- No front panel
Working Principle Carrier reads on-board registers over IndustryPack bus. ADC samples analog; DAC outputs; GPIO toggles. Carrier software provides driver.
Installation Requirements
- Solder to carrier
- Carrier power off
- Route I/O cable
- Grounding
- Temperature -40 °C to +85 °C
- Install driver
- Calibrate
Precautions
- ESD protection
- Carrier pinout match
- Do not exceed channel rating
- Store spares anti-static
- Conformal coating for harsh
- Verify channels after install
