Description
Emerson KJ4002X1‑BB1
Technical Specifications
- Slot Quantity: 8 independent I/O‑module mounting‑slots
- LocalBus Input Voltage: 12.6 VDC, maximum total load‑current 8 A
- Bussed Field‑Power Rating: maximum 30 VDC, aggregated 6.5 A across all slots
- Operating Ambient Temperature: ‑40 °C ~ +70 °C
- Storage Temperature: ‑50 °C ~ +85 °C
- Relative Humidity: 5 %‑95 %, non‑condensing
- Airborne Contaminant Grade: ISA‑S71.04‑1985 Class G3
- Protection Rating: IP20
- Shock Resistance: 10 g half‑sine pulse, 11 ms duration
- Vibration Resistance: 1 mm peak‑to‑peak amplitude for 2‑13.2 Hz; 0.7 g acceleration for 13.2‑150 Hz
- Installation Mode: vertical cabinet‑mounting, right‑side orientation
- Compatibility: all DeltaV M‑Series I/O‑modules and corresponding rotary‑keyed terminal‑blocks
- Cascading Restriction: total cumulative LocalBus carrier‑cascading‑length cannot exceed 6.5 metersEmerson
Functional Features Vertical‑right‑oriented 8‑slot layout realizes symmetrical high‑density I/O‑arrangement when paired with left‑side KJ4002X1‑BA1 vertical‑carrier. Internal printed‑circuit traces distribute LocalBus communication‑signal and 12.6 VDC operating‑power for eight module‑slots. Internal trace‑network transmits bussed field‑power‑supply to matched front‑mounted terminal‑block‑assemblies. Integrated metal EMI‑shielding‑structure suppresses external industrial‑electromagnetic‑interference noise. Hardware slot‑position‑coding supports automatic slot‑identification‑function of DeltaV system‑software. Rotary mechanical anti‑mismatch keying prevents installation of incompatible terminal‑block‑hardware. Passive‑hardware‑architecture without active‑electronic‑components lowers hardware‑failure‑probability. Individual I/O‑modules support hot‑swap‑replacement‑operation under energized carrier‑state. Blank filler‑covers install onto permanently vacant slots to preserve electromagnetic‑shielding‑integrity. Carrier‑assembly itself cannot execute hot‑swap‑disconnection, LocalBus power must be fully de‑energized before removal operationEmerson.
Application Scenarios Narrow‑width control‑cabinets of petrochemical‑complex, refinery and chemical‑processing‑plant. Installed at right‑side vertical‑mount‑position inside cabinet, paired with KJ4002X1‑BA1 left‑vertical‑carrier, realizes large‑quantity M‑Series I/O‑modules compact‑arrangement. Used for analog‑input‑output and discrete‑input‑output signal‑processing of field‑transmitters, control‑valves, limit‑switches and solenoid‑actuators.
Performance Parameters LocalBus communication‑signal maintains reliable‑transmission‑performance under full‑slot‑loaded working‑condition. Internal power‑trace voltage‑drop stays within allowable‑tolerance‑range under maximum rated‑current‑load. EMI‑shielding‑performance restrains external‑electromagnetic‑noise‑intrusion into I/O‑signal‑path. Mechanical‑clamping‑force of module‑edge‑connector keeps stable for long‑term cabinet‑vibration‑environment. Supports 7×24‑hour uninterrupted‑long‑term‑industrial‑site‑operation.
Material Composition High‑strength reinforced‑plastic carrier‑housing with integrated metal EMI‑shielding‑bar. Multilayer glass‑epoxy printed‑circuit‑board with heavy‑copper power‑carrying‑traces. Gold‑plated female edge‑connectors for mating with M‑Series I/O‑module‑plug‑in‑contacts. Stainless‑steel mounting‑hardware for right‑side vertical cabinet‑fixing and mechanical‑locking. Flame‑retardant plastic‑material conforms to industrial fire‑safety‑specification.
Structural Characteristics Vertical‑orientation modular‑construction for right‑side cabinet‑installation. Front‑side arranges eight vertical‑direction module‑insertion‑openings, each fitted with independent mechanical‑locking‑latch. Internal metal‑shielding‑bar bonds with cabinet‑protective‑ground‑potential for noise‑suppression. Rear‑side integrated multi‑pin‑connector interfaces with upstream LocalBus power‑supply and communication‑source‑hardware. Special‑designed mounting‑bracket‑position adapts vertical right‑side cabinet‑fixing‑requirement. Vertically‑arranged passive‑convection‑air‑gaps reserve heat‑dissipation‑space for inserted I/O‑modules.




