Description
KOKUSAI KOMS-A2
Technical Specifications 8 to 16 configurable analog output channels; 12-bit or 14-bit DAC conversion; Output signal ±10VDC or 4-20mA; Channel-to-channel electrical isolation; Supply voltage DC24V; Communication rate 31.25kbps to 2Mbps; Board size 125mm ×75mm ×30mm.
Functional Features High precision digital-to-analog conversion for multi-channel process control; Independent isolation for each output channel to eliminate cross-channel interference; Configurable signal range through controller software; Built-in channel over-range and short-circuit diagnosis; Non-volatile memory stores channel calibration parameters; Support closed-loop control for MFC and furnace temperature; Real-time channel status feedback to main controller.
Application Scenarios Semiconductor vertical diffusion furnace; Wafer oxidation and annealing process; CVD thin film deposition equipment; Semiconductor thermal treatment production line; Precision gas flow and temperature control in wafer fabrication.
Performance Parameters Operating ambient temperature -25℃ to +70℃; Storage temperature -40℃ to +85℃; Relative humidity 5% to 90%, no condensation; Conversion accuracy ±0.1% full scale.
Material Composition Multi-layer glass fiber PCB board; Precision DAC chips; Isolation operational amplifiers; Low-drift reference voltage components; Surface mount resistors and capacitors; Gold-plated edge connectors; Screw signal terminals.
Structural Characteristics Standard plug-in long board structure for furnace controller chassis; Edge gold finger connects to system backplane; Front side signal terminal block for field actuator wiring; Internal circuit partition for digital bus circuit and analog output circuit.
Working Principle The main furnace controller sends digital setpoint value to KOMS-A2 board via backplane bus. The on-board DAC chip converts digital command into standard analog voltage or current signal. Isolation circuit transmits analog signal to field actuators. The board continuously monitors output channel load state and uploads fault information to host controller when short circuit or overload occurs.
Installation Requirements Cut off furnace controller chassis power before inserting the board. Wear anti-static wristband during handling. Insert board smoothly into chassis slot and lock fixing latch. Connect MFC and valve wiring to signal terminals. Download channel configuration and calibration parameters after power-on, verify analog output precision. Ensure cabinet reliable protective earthing.
Usage Notes Electrostatic protection must be applied in wafer workshop environment. Backup furnace process recipe before board replacement. Do not modify internal calibration components. Conduct periodic channel calibration. Store spare board in anti-static bag under dry and dust-free environment.
