Motorola MVME177-003

Product Introduction
The MVME177-003 is a specialized variant of the MVME177 series, tailored for specific high-reliability applications. It leverages the robust MC68060 architecture and VMEchip2 ASIC to deliver deterministic performance and extensive system resources.

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Description

Motorola MVME177-003

Technical Specifications

  • Core Architecture: MC68060 microprocessor paired with the VMEchip2 system controller.
  • Memory: High-capacity ECC DRAM for maximum data throughput and error correction.
  • I/O Expansion: Connects to the VMEbus P2 connector, supporting transition boards like the MVME712x series for industry-standard I/O.

Functional Features

  • Advanced Bus Management: Features programmable map decoders for master/slave interfaces and VMEbus-to-local bus DMA controllers.
  • Storage Protection: Flash write protection is programmable through the VMEchip2 GPIO register to prevent accidental firmware corruption.
  • System Reliability: Integrated watchdog timer automatically resets the system in the event of a software hang.

Application Scenarios
Deployed in semiconductor manufacturing equipment, medical imaging systems, and scientific instrumentation requiring high-bandwidth data recording.

Performance Parameters

  • Operating Environment: Supports forced-air cooling with an exit air temperature range of -5°C to 55°C.
  • Vibration Tolerance: Rated for 2 Gs RMS (20Hz-2000Hz random) during operation.
  • Altitude Rating: Fully operational at altitudes up to 5000 meters (16,405 feet).

Material Composition
Utilizes high-Tg flame-retardant FR-4 substrates. Connectors feature gold-plated contacts to ensure long-term reliability in harsh environments.

Structural Characteristics
Standard 6U double-high VME module. The front panel includes two EPROM sockets for convenient field firmware upgrades and diagnostic LEDs.

Working Principle
The VMEchip2 ASIC manages non-DMA programmed access and DMA transfers between the VMEbus and local peripherals, minimizing CPU overhead during intensive I/O operations.

Installation Requirements
Ensure the chassis provides adequate forced-air cooling. When using transition boards, strictly adhere to the P2 cable pinout definitions.

Usage Precautions
Do not operate beyond the specified vibration and temperature limits. Exercise caution when modifying Flash memory mapping or write-protection states via GPIO registers.