Motorola MVME2700-3341

Motorola MVME2700-3341

Product Introduction
The Motorola MVME2700-3341 is a high-tier model in the MVME2700 series, pre-installed with 64MB of ECC DRAM. It inherits the superior PowerPC processing power and VMEbus compatibility of the series, providing a solid foundation for data-intensive industrial control tasks requiring larger memory footprints.

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Description

Motorola MVME2700-3341

Technical Specifications

  • Core Processor: 32-bit PowerPC 750 microprocessor.
  • Memory Capacity: Standard 64MB ECC DRAM (supports up to 256MB expansion).
  • Cache: 32KB L1 cache plus 1MB backside L2 cache.
  • Flash Configuration: 8MB onboard Flash plus 1MB socketed Flash.
  • Bus Architecture: 64-bit PCI local bus and VMEbus interface.

Functional Features

  • Enhanced Data Processing: 64MB of memory provides ample space for complex real-time control algorithms and large data buffering.
  • Advanced Communication Interfaces: Integrates a DECchip 21140 Ethernet controller and a SYM53C825A SCSI-2 controller.
  • Firmware Diagnostics: Built-in leading-edge PPCBug firmware monitor offers power-on self-test, advanced debugging tools, and OS boot support.
  • Multi-Protocol Support: Supports various serial communication protocols including EIA-232, EIA-530, V.35, and X.21.

Application Scenarios

  • Telecommunications Infrastructure: Used for network routing, high-speed data switching, and base station control.
  • Process Control: Manages complex batch process control and data acquisition in chemical or oil refining plants.
  • Test and Measurement: Acts as the core controller for high-speed data logging and analysis in Automated Test Equipment (ATE).

Performance Parameters

  • Bus Speed: Supports A32/D32 addressing and D64/MBLT block transfers.
  • Environmental Adaptability: Operates stably with inlet air temperatures from 0°C to 55°C.
  • EMI Resistance: Features excellent Electromagnetic Interference (EMI) design, suitable for high-noise industrial environments.

Material Composition
Manufactured with highly reliable industrial-grade electronic components, precision ASIC chips, and 94V-0 flame-retardant printed circuit boards.

Structural Characteristics

  • Board Specification: Standard double-high 6U VME size with a depth of 6.3 inches (10.3 inches with front panel).
  • Connector Layout: Includes P1/P2 VME connectors, PMC expansion connector, and DRAM mezzanine connector.
  • Status Indicators: Front panel equipped with status LEDs indicating power and system operation.

Working Principle
The module receives power and data through the P1 and P2 connectors on the VME backplane. The processor manages local peripherals via a PCI bridge chip and utilizes a DMA engine to perform zero-copy data transfers between the ECC DRAM and the VMEbus, achieving extremely high I/O throughput.

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