Description
SAM MXM402
Technical Specifications: Form factor: Standard MXM mezzanine module Interface: MXM gold-plated edge connector On-board memory: Dedicated graphics video memory Display output: Support multiple display signal types via host board routing Operating temperature range: 0℃ ~ +60℃ Wide temperature variant supports -40℃ ~ +85℃ Storage temperature range: -40℃ ~ +85℃ Relative humidity: 5% to 95%, non-condensing Mounting: Stacked installation on host SBC MXM socket Protection grade: IP20 when installed inside sealed embedded computer housing
Functional Features: Hardware accelerated 2D and 3D graphics rendering for industrial visualization interface. Multi-screen simultaneous display output to drive multiple industrial monitors. High bandwidth video memory for high resolution image and video data processing. Low power consumption design suitable for embedded industrial computer system. Support standard display resolution and color depth for industrial HMI application. Built-in thermal protection circuit to reduce GPU frequency automatically when overheating occurs. Stable operation under continuous vibration and electromagnetic interference environment.
Application Scenarios: Industrial machine vision workstation, embedded simulation display system, industrial human-machine interface controller, medical imaging equipment, transportation on-board display system, military embedded visualization computer.
Performance Parameters: High speed graphics rendering for real-time industrial interface refresh. Multi-channel synchronous display output without frame loss. Thermal protection circuit triggers frequency reduction once temperature exceeds threshold. Continuous operation: 24 hours stable long-term operation inside embedded computer enclosure. High resistance to shock and vibration for mobile and rugged embedded systems.
Material Composition: PCB substrate: High reliability multi-layer FR4 glass fiber epoxy printed circuit board. Core components: Industrial grade GPU chip, dedicated video memory chips, power management IC. MXM edge connector: Gold plated copper alloy contact pins. Passive components: High grade industrial capacitors and resistors. Heat dissipation: Thermal pad and optional small heat sink.
Structural Features: Compact rectangular MXM mezzanine board structure. Gold plated MXM edge connector at board edge for plugging into host SBC MXM socket. GPU chip equipped with thermal interface pad for heat transfer. Internal circuit layout separated into GPU core area, video memory area and power supply circuit area. Small size design saves space inside embedded computer housing.
Working Principle: The module is inserted into MXM socket of host single board computer. Host system transmits graphics rendering command and image data to GPU chip of MXM402 through MXM interface. GPU executes 2D and 3D graphics calculation, stores frame data in on-board video memory, and outputs display signal to host board routing circuit. The power management chip supplies stable voltage for GPU and memory. The thermal sensor continuously monitors GPU temperature, and triggers frequency reduction protection when temperature exceeds preset threshold.
Installation Requirements: Power off host embedded computer before installing MXM402 module. Align MXM edge connector with host MXM socket and insert module fully. Fix module with locking screws provided by host board. Apply thermal pad between GPU chip and chassis heat dissipation structure. Complete graphics driver installation on host operating system. Ensure sufficient air circulation inside computer housing for heat dissipation.
Usage Notes: Do not plug or unplug MXM module when host computer is powered on. Handle module carefully to avoid scratch on gold plated MXM edge connector. Wear anti-static wristband during module installation and replacement. Check thermal pad contact condition regularly to prevent GPU overheating. Do not operate module beyond rated temperature range. Prevent dust accumulation on module surface and thermal pad.
