Description
Schumacher ATCS-15 1464-0320
Technical Specifications Closed-loop liquid temperature control design; integrated temperature sensor interface; built-in heating and cooling control circuit; digital communication interface for host equipment; working medium compatible with heat transfer fluid; operating temperature range matches semiconductor process requirements; internal over-temperature and low-flow protection; 200V class AC power input.
Functional Features Collect real-time temperature signal from wafer chuck or process chamber temperature sensors. Compare measured temperature value with process setpoint and adjust heating and cooling output through internal control algorithm. Control heat transfer fluid flow and temperature to maintain stable substrate temperature. Communicate with semiconductor processing equipment host controller to receive temperature setpoints and upload operating status. Trigger protection shutdown when detecting over-temperature, fluid low flow and internal component faults. Store process alarm records and fault event logs.
Application Scenarios Semiconductor wafer etching equipment, thin film deposition process tools, photolithography auxiliary temperature control, wafer bonding process temperature stabilization, microelectronics substrate processing systems.
Performance Parameters High temperature control precision; fast response to setpoint changes; stable fluid temperature under variable process heat load; reliable multi-condition protection function.
Material Composition Control circuit PCB uses high-temperature resistant FR-4 multilayer board; temperature sampling and control chips are high-precision industrial semiconductors; fluid pipeline components adopt corrosion-resistant PTFE and stainless steel; outer chassis is welded aluminum alloy with surface anti-corrosion coating; internal sensors are precision platinum resistance temperature detectors.
Structural Characteristics Integrated cabinet structure with built-in fluid pipeline, heat exchange assembly and electronic control board. Front panel carries touch display screen and status indicator lamps. Rear panel reserves AC power input, fluid inlet and outlet ports and host communication connectors. Internal layout separates fluid pipeline area and electronic control area to prevent liquid leakage damage to circuits.
Working Principle The unit reads temperature measurement values from process-side temperature sensors continuously. The internal controller calculates deviation between actual temperature and process setpoint, adjusts heating power and cooling valve opening to change heat transfer fluid temperature. Circulating heat transfer fluid flows through the wafer chuck to carry heat away or supply heat, realizing closed-loop substrate temperature stabilization.
Installation Requirements Install the unit on the designated platform of semiconductor process equipment. Connect heat transfer fluid pipeline to inlet and outlet ports and complete pipeline leak test. Wire AC mains power and host communication cable to corresponding rear panel interfaces. Configure temperature control parameters and protection thresholds through the built-in human-machine interface. Conduct temperature stability test with circulating fluid before wafer process trial run.
Precautions for Use Use the heat transfer fluid specified by Schumacher. Regularly replace filter elements inside the fluid loop to prevent pipeline blockage. Only authorized professional engineers can open the cabinet for internal maintenance. Cut off power supply and release pipeline pressure before pipeline maintenance.
