Description
Brooks 001-4130-03
Technical Specifications:
- Brand: Brooks Automation
- Model: 001-4130-03
- Product Series: VCE Series
- Alignment Accuracy: ±2μm (X/Y axes) and ±0.1 mrad (θ axis)
- Repeatability: 0.5μm (X/Y axes) and 0.05 mrad (θ axis)
- Scanning Range: ±20mm (X/Y axes) and ±5° (θ axis)
- Control Speed: 100mm/s (X/Y axes) and 10°/s (θ axis)
- Load Capacity: 5 kg
- Operating Temperature: -40°C to 85°C
Functional Features:
- Sub-Micron Precision: Utilizes advanced positioning algorithms and high-precision servo motors with encoders to achieve nanometer-level control accuracy.
- Rapid Dynamic Response: Capable of completing alignment operations in approximately 1 second, adapting seamlessly to high-speed production cadences.
- Multi-Axis Synchronization: Simultaneously controls multiple robot axes to satisfy complex operational requirements.
- High Reliability and Redundancy: Features dual power supplies, dual communication links, and fault self-diagnosis to guarantee continuous operation even if a single component fails.
- User-Friendly Interface: Supports multiple programming languages and provides an intuitive interface for easy configuration and maintenance.
Application Scenarios:
Extensively utilized across semiconductor manufacturing (including wafer cleaning, photolithography, etching, deposition, CMP, and testing), solar cell production, LED manufacturing, and other precision engineering fields requiring high-accuracy alignment.
Performance Parameters:
- Control Precision: Nanometer-level positioning with an error margin of ±0.1μm.
- Environmental Protection: Engineered with shockproof, dustproof, and moisture-proof capabilities to withstand harsh industrial environments.
Material Composition:
Constructed using high-grade industrial materials and precision-machined components, designed to maintain structural integrity and performance in vacuum and high-temperature conditions.
Structural Characteristics:
Features a highly integrated, modular design that facilitates easy installation, maintenance, and system upgrades. It supports a wide variety of I/O interfaces for seamless integration with wafer transport systems and exposure equipment.
Working Principle:
The controller processes real-time feedback from high-precision sensors and executes advanced servo control algorithms. It continuously adjusts the drive signals to the actuators, dynamically correcting the wafer’s position and orientation to maintain strict alignment tolerances.
Installation Requirements:
Must be installed in a controlled environment with proper grounding. Ensure all mechanical connections are secure and that communication cables are shielded to prevent electromagnetic interference.
Usage Precautions:
Adhere strictly to electrostatic discharge (ESD) protocols during handling. Perform regular calibration checks and utilize the built-in self-diagnostic tools to preemptively identify and resolve potential system anomalies.
