Description
GE IC200CHS006 Technical Specifications
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Carrier Type: Local Communications / High-Density I/O
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Terminal Type: Screw-type (high-density)
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Wiring Capacity: 0.5 mm² to 2.5 mm² (20 to 12 AWG)
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Module Capacity: 1 VersaMax module
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Mounting: 35 mm DIN rail (EN 50022)
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Current Rating: 8 A per power/ground; 2 A per I/O point
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Voltage Transients: 300 VAC maximum
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Backplane Connection: Integrated male/female bus connectors
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Backplane Supply: 5 VDC
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Current Consumption: Approximately 5 mA
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I/O Data Handling: Up to 244 bytes depending on installed module
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Dimensions: 120 × 100 × 30 mm (approximate)
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Weight: 0.21 kg (0.46 lbs)
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Operating Temperature: 0°C to +60°C
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Storage Temperature: 40°C to +85°C
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Relative Humidity: 10% to 95% non-condensing
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Maximum Altitude: 1000 m without derating
Functional Features The carrier accommodates complex wiring requirements of communication modules including multiple bus lines and shield terminations. It eliminates the need for external splice blocks. The integrated backplane connectors pass logic power and bus signals seamlessly while maintaining pin contact integrity for deterministic data transfer required by fieldbus protocols.
Supported Communication Protocols Depending on installed IC200BEM module:
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PROFIBUS-DP
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DeviceNet
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AS-Interface
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Ethernet/IP (module dependent)
Data Rate Performance
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Low-speed: 9.6 Kbaud
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High-speed: Up to 12 Mbaud
Installation Requirements Snaps directly onto grounded DIN rail for EMC protection. Optional panel mounting via integrated latch points. Proper grounding reduces electrical noise and ensures stable communication performance in electrically noisy environments. Module installation is tool-free with secure latch retention.
