Description
NI PXIe-4145 Source Measure Unit Module
Technical Specifications Model: PXIe-4145 Form Factor: 3U single-slot PXI Express module Channel Count: 4 independent SMU channels Voltage Range per Channel: ±24 V Maximum Current per Channel: ±500 mA Maximum DC Power per Channel: 12 W sourcing and sinking Front Connector: 25-pin male D-SUB connector Operating Temperature: 0 ℃ ~ +55 ℃ Storage Temperature: -40 ℃ ~ +70 ℃ Relative Humidity: 10% ~ 70% non-condensing Maximum Operating Altitude: 2000 m PXIe Backplane Power Supply: 12 V and 3.3 V power rail input
Functional Features Four independent four-quadrant SMU channels support bidirectional power supply and absorption. Built-in four-wire remote sensing circuit for high precision voltage measurement at device terminals. High-speed hardware sequencing engine supports synchronized multi-channel I-V sweep test. Independent overvoltage, overcurrent and overtemperature protection for every output channel. Dual synchronized ADCs on each channel for simultaneous voltage and current sampling. Programmable aperture time to suppress power frequency noise interference. NI-DCPower instrument driver supports programming under LabVIEW, Python and other development environments. Supports trigger bus synchronization with other PXIe instruments.
Application Scenarios Power semiconductor device testing, high power LED characterization, lithium battery cell testing, relay and contactor performance test, automotive power electronic component validation, multi-channel power sensor calibration.
Performance Parameters High precision voltage and current measurement after specified warm-up and self-calibration. Protection circuit activates fast shutdown once channel exceeds rated power or current. Remote sensing eliminates cable resistance error for low resistance measurement. Hardware sequencing engine executes test sequence without host computer real-time intervention. Module maintains stable measurement performance under continuous long-time operation. Trigger bus realizes precise time synchronization between multiple PXIe modules.
Material Composition Module Housing: Black flame-retardant plastic front panel and metal electromagnetic shielding frame. Main PCB: FR4 multi-layer printed circuit board with conformal coating protection. Core Electronic Components: FPGA, high-speed DAC and ADC, high power output amplifier, precision current sampling resistor, power transistor, static protection chip, flash memory. Connector: Gold-plated D-SUB front connector and gold-plated PXIe backplane edge connector. Indicator Components: LED status indicators on front panel. Fasteners: Stainless steel screws and metal shielding clips.
Structural Features 3U single-slot PXIe standard mechanical structure. Front panel integrates D-SUB signal connector and module status LED indicators. Metal shielding shell covers internal circuit board to restrain electromagnetic emission and external interference. Rear gold-plated edge connector connects with PXIe chassis backplane for power supply and high-speed bus communication. Internal circuit layout separates high-power output circuit, analog measurement circuit and digital control circuit. Ventilation openings reserved for chassis forced air cooling.
Working Principle PXIe chassis backplane supplies DC power and PXIe high-speed communication signal to PXIe-4145 module. Onboard FPGA receives test instruction from host PC through PXIe bus, controls DAC chip to generate target voltage or current signal. The high-power output amplifier drives signal to DUT via front panel connector. Sensing circuit collects voltage and current value synchronously through dual ADCs. Remote sense terminals capture voltage directly at DUT terminals to remove voltage drop of test wire. FPGA uploads measured data to host controller through PXIe bus. Real-time monitoring circuit detects output voltage, current and module temperature continuously. Once fault threshold is reached, protection circuit cuts off channel output immediately.
Installation Requirements Shut down PXIe chassis power before installing or removing module. Insert module into empty PXIe slot, push steadily until backplane connector fully engages and front panel locks. Connect DUT with shielded multi-core cable to front D-SUB connector, use four-wire wiring for high precision measurement. Install NI-DCPower instrument driver and NI MAX configuration software on host computer. Power on chassis, identify hardware and configure module parameters in NI MAX. Keep airflow path unobstructed for chassis cooling fan. Complete module self-calibration before starting formal test.
Usage Precautions Do not exceed rated voltage, current and power limit of each channel. Use shielded signal cables and single-point grounding of shielding layer. Separate test signal wiring from high-power AC power cables. Do not operate in environment with condensation, corrosive gas or heavy conductive dust. Do not open shielding housing without professional authorization, PCB carries static sensitive components. Execute regular calibration according to manufacturer specified cycle. Cut off channel output and disconnect DUT before modifying test wiring.
